The important problems facing manufacturing industries wishing to utilize this technology is feasibility analysis to decide whether a SPM can be utilised for production of the given part and if it is feasible which SPM components would be appropriate. Since the cost of utilizing SPM is high, feasibility analysis must be performed before any investment on detailed design. This paper proposes a technical feasibility analysis method which assists in deciding whether SPM is applicable for machining a given part to achieve the highest productivity. The method is based on the framework which consists of relations between the desired part properties to the characteristics of the SPM components. These relations are captured as rules and constraints in an intelligent system which is implemented in Visual Basic. Applying the proposed method to a number of industrial parts shows that it is a very useful tool in deciding when SPMs should be utilized.The use of different sets of values of creep parameter in Garofalo-Arrhenius constitutive creep relation has generated distinct magnitude of creep strain (?acc) and strain energy density (?acc) for the same set of solder joints in electronic assemblies. This study evaluates the effect of the use of four set of values on predicted magnitude of damage (?acc, ?acc) and number of cycle to failure (Nf(eacc) and Nf(?acc)) of two different solder joint geometries. The four set of values, proposed by Lau (2003), Pang et al. (2004), Schubert et al. (2003) and Zhang et al. (2003), are used to generate four hyperbolic sine creep relations. The relations are inputted in Ansys FEM software used to simulate the damage on Sn[3.0–4.0%]Ag[0.5–1.0%]Cu solder joints in flip chip model FC48 D6.3C457DC and resistor model R102. The components are assembled on printed circuit boards; and the relations are characterised by comparing the magnitude of each model simulation output with a reference least value. The assemblies are subjected to accelerated high-temperature cycles utilising IEC standard 60749–25 in parts. It was found that each model produces distinctive magnitude and history of stress, strain, hysteresis loop, ?acc, ?acc, Nf(eacc) and Nf(?acc) with the values of stress and hysteresis loop histories generated using Pang et al. and Schubert et al. models being very close. Characterisation results show that the use of ?acc as input parameter in fatigue life model proposed by Syed 2004 demonstrates higher probability of predicting accurately the damage in resistor solder joints while the use of ?acc demonstrates higher probability for BGA flip chip solder joints. Based on these results, the authors propose a paradigm for selecting suitable constitutive model(s) for accurate ?acc, ?acc and Nfprediction whilst suggesting the development of new solder constitutive relations.